TLDR Tech / News
US AI Chip Packaging Gets $2B Boost from GlobalFoundries and TSMC
GlobalFoundries and TSMC have entered into a $2 billion agreement to bolster the U.S. supply of silicon interposers crucial for TSMC's CoWoS advanced packaging. This five-year partnership will see GlobalFoundries expand its manufacturing capabilities at its Malta, New York site to meet the increasing need for high-performance computing and AI components. Production is slated to begin increasing in the first half of 2028.
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