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TSMC and GlobalFoundries partner for US silicon interposer production
GlobalFoundries has entered into a $2 billion agreement with TSMC to manufacture silicon interposers for TSMC's CoWoS advanced packaging technology. This production will take place at GlobalFoundries' facility in Malta, New York. The multi-year collaboration aims to alleviate domestic semiconductor supply chain issues for AI datacenters and advanced processors in the U.S. Production is anticipated to commence in the first half of 2028.
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