Lumentum, Qualcomm, and Corning Demo Optical Die-to-Die Links to Replace Copper in AI Racks

2026-09-25

Lumentum, Qualcomm, and Corning are jointly demonstrating a board-level optical die-to-die interconnect at ECOC 2026, aimed at extending high-bandwidth, low-latency chip-to-chip connectivity well beyond what copper traces can support in AI systems.