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GlobalFoundries to produce AI chip component for TSMC in New York
GlobalFoundries has secured a five-year contract with TSMC to manufacture silicon interposers at its facility in Malta, New York. This agreement designates the Malta plant as the sole U.S. provider of these essential components, which are critical for advanced AI chip packaging. Full-scale production is anticipated to commence in the first half of 2028, as the industry addresses limitations in AI chip manufacturing capacity.
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