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GlobalFoundries to make US-based silicon interposers for TSMC
GlobalFoundries and TSMC have signed a $2 billion, five-year deal for GlobalFoundries to manufacture silicon interposers for TSMC's CoWoS advanced packaging in the United States. Production is slated to begin in the first half of 2028 at GlobalFoundries' facility in Malta, New York, aiming to secure a domestic supply of components for AI and high-performance computing processors.
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