TLDR Tech / Hardware
First look inside Apple's AI servers reveals a densely packed M-series design
Leaked photos of a custom 2U rack server, reportedly from Apple's Houston manufacturing facility, show its Private Cloud Compute hardware for the first time. Each unit packs four columns of eight boards apiece (32 chips total), with a single Apple Silicon package at the center of each board flanked by removable brackets, all cooled by one fan per column pulling air front-to-back through a plastic-enclosed passage. Forum analysis of the board sizes suggests these are more likely base M5-class packages rather than the M5 Ultra chips previously rumored, since an Ultra package (two dies plus eight memory chips) would be roughly four times larger than what's visible in the photos, and the heatsinks look undersized for a 150-watt chip
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