TLDR Tech / Hardware
CXMT reportedly begins risk production of HBM3E, targeting mass production in 2027
CXMT has reportedly started risk production of HBM3E, a generation behind the HBM4 that Micron, Samsung, and SK hynix are already mass producing, but a meaningful jump for a company that only recently began mass-producing standard DRAM at competitive nodes. HBM is substantially harder to manufacture than ordinary DRAM, requiring high-yield die stacking, through-silicon vias, fine interconnects, thermal management, and packaging on top of competitive dies themselves, so reaching even a risk-production milestone signals China's memory ecosystem advancing past commodity DRAM.
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